ANSYS provides electronics cooling simulation products for chip, package and board thermal analysis as well as thermo-mechanical stress analysis.
ANSYS simulation tools help you manage excessive heat that can otherwise lead to increasing leakage and electromigration failures of the chip, as well as analyse die package, PCB and interconnect thermal differential expansion to enhance reliability of the entire electronic system.
Ansys’ industry leading computational fluid dynamics (CFD) solutions, along with chip-level thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems. You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance.