Ansys SIwave is a specialised design platform for power integrity, signal integrity and EMI analysis of IC packages and PCBs.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full-wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low voltage designs.
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards. By leveraging advanced electromagnetic, thermal and mechanical simulators dynamically linked to powerful circuit and system simulation, you can understand the performance of high-speed electronic products long before building a prototype in hardware. This approach enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
Applications of Software
Ansys SIwave Solvers
Layout and Geometry Import
Simulate the electromagnetic behaviour of printed circuit boards and electronics packages with SIwave.
Enables you to easily and seamlessly import ECAD geometries and materials directly from major EDA layout tools.
Electrothermal and Mechanical Analysis
Provides automatic convergence between electromagnetic PDN analysis and CFD thermal simulation. Automatic data transfer to Ansys Mechanical identifies premature component failure due to thermal stress.
Adds tremendous value to electromagnetics simulation by enabling large, high-fidelity models that yield accurate and detailed insight into the performance of your design.
IBIS and IBIS-AMI SerDes Analysis
SIwave’s circuit simulator is fully compatible with IBIS and IBIS-AMI driver/receiver models.
Quickly determine if your DDR3/4 bus design will pass or fail Jedec standards.
Automated Decoupling Capacitor Optimisation
Impedance and Cross-talk Scanning
Optimise capacitor placement and reduce cost of PCB and electronic package designs.
Provides automatic scanning of PCB or package layout to determine the anticipated impedance Near and Far End crosstalk coefficients.
Multidomain System Modelling
Integrated modelling capability to analyse electromagnetic components within a systems environment
Predict migration of metal atoms in a conductor caused by electric current.
Identify areas of potential interference on your PCB design.
Unified platform for electromagnetic, electromechanical, circuit and system simulation. HFSS, Maxwell, Q3D Extractor, Icepak and Simplorer are built into the Electronics Desktop, which serves as a universal pre- and post- processor for these tools.