Wilde Analysis Ltd

engineering by analysis

  • Home
  • Capabilities
    • Design Simulation
      • Structural Analysis (FEA)
      • Fluid Dynamics (CFD)
      • Computational Electromagnetics (CEM)
      • Thermal Management
      • Design Code Assessment
      • Design for Reliability
      • All Design Simulation
    • Manufacturing Process Simulation
      • Metalforming, Machining & Heat Treatment
      • Plastic Injection Moulding
      • Plastic Packaging & Extrusion
      • Additive Manufacturing & 3D Printing
      • Process Optimisation
      • Asset Performance Management
      • All Manufacturing Process Simulation
    • Built Environment Simulation
      • Wind Engineering
      • Daylight, Sunlight & Right to Light
      • Geotechnical & Structural Analysis
      • Heating, Ventilation & Air Conditioning (HVAC)
      • Cleanroom & Hygienic Zone Design
      • Data Centre Cooling
      • All Building Physics
  • Industries
    • Aerospace & Defence
    • Industrial Equipment
    • Oil & Gas
    • Automotive & Off-Road
    • Marine & Subsea
    • Plastics, Composites & Rubber
    • Built Environment
    • Medical & Healthcare
    • Rail
    • Chemical & Process
    • Metals
    • Renewable Energy
    • Consumer Products
    • Nuclear
    • University & Research
    • Electronics & Electrical
    • All Industries
  • Simulation Software
    • Ansys Software
      • 3D Design
      • Structures
      • Fluid Dynamics
      • Electronics
      • Materials
      • All Solutions
    • Manufacturing Process Software
      • DEFORM – Bulk Metalforming & Heat Treatment
      • Ansys LS-DYNA — Sheet Metalforming
      • Moldex3D — Plastic Injection Moulding
      • Ansys Polyflow — Polymer Extrusion & Thermoforming
      • Ansys Additive — Topology & 3D Printing
      • Flownex — 1D Fluid Systems
    • Built Environment Software
      • PLAXIS — Geotechnical Analysis
      • gINT — Geotechnical Data Management
      • SOILVISION — 2D/3D Slope Stability
      • TALREN — 2D Slope Stability
      • CivilFEM for Ansys — Structural Analysis
      • Ansys CFD — Wind Microclimate Studies
  • Consulting
    • Capabilities
      • Design Simulation (FEA, CFD & CEM)
      • Manufacturing Process Simulation
      • Built Environment Simulation
      • Safety & Reliability Analysis
      • Design, Materials & Testing
    • Services
      • Project Options
      • Staffing & Secondments
      • Gap Analysis
      • Technology Transfer
      • Technical Support
    • Assurance
      • Experience
      • Certifications & Associations
      • Software Tools
      • Quality & Environmental Management
      • Cyber Security & Data Protection
  • Training
    • Online Courses
      • Simulation Theory & Best Practice
      • Ansys
      • DEFORM
      • Moldex3D
      • Safety & Reliability
    • Classroom Courses
      • Simulation Theory & Best Practice
      • Ansys
      • DEFORM
      • Moldex3D
      • Safety & Reliability
    • On Request Training
      • PLAXIS
      • Design By Analysis
      • Design for Electromagnetic Compatibility (EMC)
      • Safety & Reliability
  • Support
  • Resources
  • About Us
    • Our Company
      • Senior Management
      • History
      • Careers
      • Legal Notices
      • WildeRisk.co.uk
    • Assurance
      • Experience
      • Certifications & Associations
      • Quality & Environmental Management
      • Cyber Security & Data Protection
      • Privacy Policy
    • What’s On
      • Training & Events Calendar
      • Webinars, Seminars, Conferences & Exhibitions
      • News
      • Blogs
      • Community Support
  • Contact
  • LinkedIn
  • Twitter
  • Facebook
  • YouTube
  • Blog
  • +44 (0) 161 474 6886
  • LinkedIn
  • Twitter
  • Facebook
  • YouTube
  • Blog
  • +44 (0) 161 474 6886

Thermal Management

Home » Engineering Simulation & Risk Management Capabilities » Design Simulation » Thermal Management

Understanding thermal behaviour and the structural response of your designs is crucial for creating reliable products. Our dedicated FEA, CFD & manufacturing simulation capabilities and reliability engineering experience support component selection and packaging decisions to avoid heating issues while minimising product cost.

Software & Consulting

In conjunction with our Structural Analysis capabilities, we regularly solve thermal problems using FEA & CFD methods within Ansys, coupled with structural models when required to predict thermal stresses and expansion/contraction. Applications include machinery and infrastructure involved in energy generation and conversion, valves and compressors, furnace equipment and domestic appliances. The design and performance of electronic equipment in particular is heavily influenced by thermal issues, including how to dissipate heat and cope with stresses resulting from temperature gradients. Systems and devices are becoming smaller while increasingly complex and power-hungry.  This results in higher power densities with the task of removing excessive heat to retain operational performance and reliability becoming ever more challenging. Benefits of thermal management simulation during concept design and development stages include:

  • Identify compromises with hardware design
  • Locate problem areas and evaluate alternatives before basic layout is locked down
  • Easy validation of design modifications before building any physical prototypes
  • Select cooling-related hardware
  • Explore operational scenarios
  • Undertake Design for Reliability (DFR) activities

Ansys CFD can predict steady-state and transient natural and forced convective flows, conjugate heat transfer and even radiation using the flexible FLUENT and CFX solvers. However, to efficiently model electronic components and assemblies, we also provides the Ansys Icepak solution, developed specifically to to quickly set up and solve thermal management problems within IC packages, printed circuit boards, rack mounts and complete electronic systems.

Typical thermal management simulation using ANSYS Icepak
Typical thermal management simulation using ANSYS Icepak

For electronic design companies without the immediate capability to undertake simulations inhouse, we provide consulting services including design guidance in fan and ventilation grid sizing, heat sinks and other options for dissipating heat. For organisations running large numbers of power-intensive electronics-based equipment, such as Data Centres, we can take a systems approach to HVAC design, considering a room or entire building. We can also use an initial project to subsequently introduce FEA or CFD software into our clients’ own DFR processes. In the project shown below, the objective was to evaluate surface temperatures of various ICs and subsystem modules within fan-cooled test equipment and use the analysis to advise on fan selection.

Prediction of subsystem package surface temperatures (Courtesy: Plextek Ltd)
Prediction of subsystem package surface temperatures (Courtesy: Plextek Ltd)

In other projects, we have investigated alternative cooling fin arrangements while constrained by tight packaging restrictions within cabinets, combining CFD simulations with analytical heat transfer models to derive an optimised configuration.

Optimised cooling fin design within cabinet
Evaluation of temperatures and heat fin optimisation for Compact PCI module

When designing enclosures with thermal management considerations, positioning and detailing of ventilation holes and other features can have significant implication on the ease and cost of manufacture. Our Plastic Injection Moulding and Sheet Metal Forming simulation capabilities can help resolve any manufacturing issues encountered with packaging.

    Enquiry Form

    Please refer to our Privacy Policy regarding how we may process any personal data you submit within this form.

    • Ansys Icepak
    • Data Centre Cooling

    Selected Resources

    • » Article: The Big Data Chill – Thermal Simulation with ANSYS Icepak

    • » Brochure: ANSYS Icepak

    • » Brochure: Flownex 1D Thermo-Fluid Simulation

    • » Overview Video: Beat The Heat with ANSYS Icepak

    • » Webinar Video: Thermal Management of Electronic & Electro-Mechanical Products

    View more resources »

    Selected Training Courses

    • » FEA Principles

    View full calendar »

    Client Feedback

    Prev

    ANSYS AIM allowed UEL to run multiphysics analysis of heat transfer for a new engine where testing of prototypes would usually be the method used. The engine is still in early stages but dozens of analyses have been run, steering the project in its direction. What AIM offered over other platforms was a relatively cheap but powerful solver which is very intuitive. The addition of finning to the engine housing is currently set to reduce the maximum housing temperature by up to 51% and not a single prototype has been manufactured yet.

    UAV Engines

    Fantastic training – moved at a manageable pace with a good emphasis on company specific challenges. Would thoroughly recommend.

    Sterling Thermal Technologies

    We’d like to thank you for your help with this project. Getting such concise and helpful information back will ultimately help in our quest to buy the ANSYS software.

    Victor Lighting

    Wilde quickly understood the scope of the analysis & defined precisely the engineering information that would be required....... The product design was modified on the basis of the analysis. Samples subsequently passed rigorous environmental testing including vibration & drop testing before the design was released for high volume production.…pleased with the time Wilde take to understand our requirements …used them on a number of projects.

    Plextek
    Next
    • Events

      • » Model Bulk Phase Change Processes Using Ansys Fluent | Ansys Webinar
      • » Webinar: Achieving Lightweight Part Through Fluid-Assisted Injection Molding | Moldex Webinar
      • » High-Fidelity Thermal Analysis for the Design and Verification of Electric Motors| Ansys Webinar
      • » Accelerating EMI/EMC Testing Using Simulation | Ansys Webinar
      • » Ansys Maxwell in Ansys 2021 R1– Simulation for Electric Drive Applications | Ansys Webinar
    • News

      • » NAFEMS UK Virtual Conference 2020: Learn about Leading Engineering Simulation and Risk Management Solutions
      • » Buying PLAXIS geotechnical FEA software is more flexible & cost effective than ever!
      • » Ansys 2020 R2 Accelerates Innovation for Engineering Teams
      • » Pollution Solution and Wilde feature in The Times Newspaper: Pollution filter maker eyes opportunity
      • » Moldex3D and Wilde Analysis Team Up to Provide Face Masks to North West Learning Community
    • Latest Tweets

    • Contact Details

    • Wilde Analysis Ltd.
      Whitworth House
      28 Charles St
      Stockport
      Cheshire
      SK1 3JR

    • t: +44 (0)161 4746886

    © 2021 Wilde Analysis Ltd

    UK Web design & hosting by BFI®

      • Home
      • Industries
        • Aerospace & Defence
        • Automotive & Off-Road
        • Chemical & Process
        • Built Environment
        • Consumer Products
        • Electronics & Electrical
        • Industrial Equipment
        • Marine & Subsea
        • Medical & Healthcare
        • Metals
        • Nuclear
        • Oil & Gas
        • Plastics, Composites & Rubber
        • Rail
        • Renewable Energy
        • University & Research
      • Engineering Simulation & Risk Management Capabilities
        • Design Simulation
        • Manufacturing Process Simulation
      • Engineering Simulation & Risk Management Software
        • Design Simulation
        • Manufacturing Process Simulation
        • Safety & Reliability Analysis
      • Consulting
        • Capabilities
        • Services
        • Assurance
      • Training
        • Software Product Training
        • Design & Simulation Training
        • Safety & Reliability Training
      • Support
      • Resources
      • About Us
        • Our Company
        • Assurance
        • What’s On
      • Contact

    Cookies

    We use cookies as set out in our privacy policy. By using this website, you agree we may place these cookies on your device Find out more