ANSYS HFSS is the industry standard software for engineers undertaking accurate and rapid design within high-frequency and high-speed electronic devices and platforms.
ANSYS HFSS‘ gold-standard accuracy, advanced solvers and high-performance computing technologies make it an essential tool for high frequency electromagnetic design and validation. It offers state-of the-art solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods to address a wide range of microwave, RF and high-speed digital applications.
HFSS delivers 3-D full-wave accuracy for components to enable RF and high-speed design. By leveraging advanced electromagnetic field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, HFSS breaks the cycle of repeated design iterations and lengthy physical prototyping. With HFSS, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, high-speed interconnects, connectors, IC packaging and PCBs.
Design sign-off accuracy is provided by HFSS through its groundbreaking and industry-leading adaptive meshing technology. Its powerful meshing and solver technologies enable you to design with confidence, knowing the results provided by HFSS can be relied on. Other tools simply give answers without any feedback regarding the accuracy of the solution, leading to uncertainty. When combined with ANSYS HPC technologies, like domain decomposition or distributed frequencies, HFSS can simulate at a speed and scale never before thought possible, further allowing you to more fully explore and optimize your device’s performance. With HFSS you know your designs will deliver on their product promise.
ANSYS HFSS combines the highly accurate finite element method (FEM), the large-scale method of moments (MoM) technique, the ultra-large-scale asymptotic methods of physical optics (PO) and shooting and bouncing rays (SBR).
Solvers included with ANSYS HFSS:
HFSS: 3-D, Full-Wave, frequency domain EM solver based on the finite element method. Engineers can reliably extract SYZ parameters, visualize 3-D electromagnetic fields, and generate component models to evaluate signal quality, transmission path loss, impedance mismatch, parasitic coupling and far-field radiation.
HFSS Transient: Simulate transient EM field behavior and visualize fields or system responses in applications such as time domain reflectometry (TDR), ground-penetrating radar (GPR), electrostatic discharge (ESD), electromagnetic interference (EMI) and lightning strikes. This technology complements the frequency domain solution in HFSS, and enables engineers to understand the electromagnetic characteristics on the same mesh and in whichever domain is desired.
HFSS SBR+: Advanced antenna performance simulation software that provides fast and accurate prediction of installed antenna patterns, near-fields and antenna-to-antenna coupling on electrically large platforms. It leverages the asymptotic Shooting and Bouncing Ray Plus (SBR+) technique to efficiently compute accurate solutions with incredible speed and scalability.
HFSS IE: he HFSS-IE (Integral Equation) uses the method of moments (MoM) technique in 3-D. It is ideal for radiation studies, such as antenna design or placement, and scattering studies such as radar cross section (RCS). The solver can employ either multilevel fast multipole methods (MLFMM) or adaptive cross-approximation (ACA) to reduce memory requirements and solve times, allowing this tool to be applied to very large problems.
HFSS Hybrid Technologies: The Finite Element-Boundary Integral (FE-BI) hybrid technology provides an ideal absorbing boundary condition for HFSS. Simulations involving antenna platform integration can be significantly reduced in size by allowing a conformal radiation boundary, including concave geometries, that reduces the overall volume of the finite element domain.
The FEM-IE hybrid technology is built upon HFSS, HFSS-IE and the domain decomposition method (DDM). to solve electrically large and complex systems. By locally applying the appropriate solver technology, regions of high geometric detail and complex material properties can be addressed with finite element HFSS, and regions of large objects or installed platforms can be addressed with 3-D MoM HFSS-IE. This solution is delivered in a single setup and solved with a single, scalable system matrix.
Automatic Adaptive Meshing
Automatic adaptive meshing techniques require you to specify only geometry, material properties and the desired output. The meshing process uses a highly robust volumetric meshing technique, and includes a multithreading capability that reduces the amount of memory used and accelerates time to solution. This proven technology eliminates the complexity of building and refining a finite element mesh and makes advanced numerical analysis practical for all levels of your organization.
Optimized User Environment
The full-featured 3-D solid modeler and layout interface enables you to work in a layout design flow, or to import and edit 3-D CAD geometry.
HFSS 3-D Modeler: The 3-D interface enables you to model complex 3-D geometry or import CAD geometry for simulation of high-frequency components, such as antennas, RF/microwave components and biomedical devices. You can extract scattering matrix parameters (S,Y, Z parameters), visualize 3-D electromagnetic fields (near- and far-field), and generate ANSYS Full-Wave SPICE models that link to circuit simulations.
HFSS 3-D Layout: HFSS 3-D Layout is an optimized interface for layered geometry of PCBs, IC packages or on-chip embedded passives. Geometry is assembled and rendered in a 2-D design environment; however, all effects are rigorously simulated, including 3-D features such as trace thickness and etching, bondwires, solder bumps and solder balls. Layout primitives such as stack-up dimensions, anti-pad radius, trace widths or thicknesses can be easily parameterized in the design environment. HFSS 3-D Layout includes advanced phi meshing technology that is optimized for meshing silicon substrates, redistribution layers, electronic packages and PCBs.
HFSS can create 3-D EM simulation components and integrate them into larger assemblies and systems, cutting design time and fostering collaboration while protecting IP. These 3-D components can include antennas, connectors, phased arrays and highly integrated chip-package-board systems that, when utilized in HFSS, create a complete and accurate description of the devices. This capability is especially useful for sharing detailed device models within an organization and between supplier and system integrators. Simulation-ready 3-D components can be created by an expert component designer, stored in library files, and then easily added to larger system designs. You can optionally encrypt and hide design information in the 3-D component, including geometry, materials and other critical IP, and then share the component throughout the supply chain. The shared component’s behavior is fully captured in the subsequent HFSS simulation without compromising on accuracy. Sharing encrypted components enables system integrators to capture the complete electromagnetic interaction between a component, such as a supplier-provided antenna, and the installed platform.
Advanced Phased Array Antenna Simulation
ANSYS HFSS can simulate phased-array antennas with all electromagnetic effects, including element-to-element coupling, embedded element patterns, scan input impedance and near- or far-field radiation. Infinitely large and finite-sized arrays can be simulated efficiently by exploiting the periodic nature of the geometry.
For infinite arrays, one or more antenna elements are placed within a unit cell with periodic boundary conditions on the surrounding walls to mirror fields creating an infinite number of elements in two directions. Per-element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array blind zones that can occur under certain scan conditions.
The finite-sized array simulation technology leverages HPC domain decomposition to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.
ANSYS Electronics HPC goes well beyond simple hardware acceleration to deliver groundbreaking numerical solvers and HPC methodologies optimized for multicore machines, while being scalable to take advantage of full compute cluster power.
Multithreading: ANSYS Electronics HPC takes advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, matrix solves, and field recovery.
Spectral Decomposition Method: The spectral decomposition method (SDM) accelerates frequency sweeps by distributing multiple frequency points in parallel over compute cores and nodes.
Domain Decomposition Method: The domain decomposition method (DDM) accelerates the solution for larger and more complex geometries by distributing a simulation across multiple cores and networked nodes.
Periodic Domain Decomposition: Periodic domain decomposition applies DDM to finite periodic structures such as antenna arrays or frequency selective surfaces. This method virtually duplicates the geometry and mesh of the periodic unit cell and then applies the DDM algorithm to the resulting finite-sized array to solve for the unique fields for all elements.
Hybrid Domain Decomposition Method: Hybrid DDM uses DDM on models consisting of finite element (FEM) and integral equation (IE) domains. This methodology combines the virtues of FEM’s ability to handle complex geometries plus MoM’s efficient solutions for antenna and radar cross-section analysis.
Distributed Direct Matrix Solver: The distributed direct matrix solver is a distributed memory parallel technique for HFSS. The matrix solution is distributed across multiple cores or MPI-integrated computers. It provides improved scalability through increased memory access and networked core access.
ANSYS RF Option
The ANSYS RF Option combined with HFSS creates an end-to-end high-performance RF simulation flow. Its features include a harmonic balance circuit simulation, 2.5-D planar method of moments solver, filter synthesis and more. It also includes EMIT, a unique multifidelity approach for predicting RF cosite interference to identify root-cause EMI issues in complex RF environments.
Autonomous Plus Driven Sources Option
Multicarrier Modulation Support
ANSYS SI Option
The ANSYS SI option is ideal for analyzing signal integrity, power integrity and EMI caused by shrinking timing and noise margins in ICs, packages, connectors and PCBs. The ANSYS SI option adds transient circuit analysis to HFSS, which enables you to create high-speed channel designs that include the driving circuitry as well as the channel. The driving circuitry can be transistor level, IBIS-based or ideal sources. Users can select from a variety of analysis types:
ANSYS Full-Wave SPICE, included in ANSYS HFSS, provides frequency-dependent SPICE models for accurate time-domain simulation in time-domain circuit analysis tools. ANSYS Full-Wave SPICE models can be created for use with ANSYS Nexxim, HSPICE®, Spectre® RF and MATLAB®. Full-Wave SPICE produces highly accurate, high-bandwidth SPICE models at the touch of a button. This capability enables you to design electronic and communication components while taking gigahertz-frequency effects into account.