ANSYS Icepak software provides robust and powerful computational fluid dynamics (CFD) for electronics thermal management. Icepak combines advanced solver technology with robust meshing options designed to provide fast and accurate thermal results for electronics cooling applications. For more than a decade, companies around the world have relied on Icepak to carry out rapid heat transfer and fluid flow analysis of IC packages, printed circuit boards and complete electronic system as well as to perform easy validation of design modifications before building any physical prototypes.