- 12th February 2019
4:00 pm - 5:00 pm
Join us to learn about the new capabilities available in ANSYS Icepak. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include: Electro-thermal analysis — Two-way closed loop coupling between ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and Icepak
- Modelling of inclined PCB
- DCIR EM loss coupling
Don’t miss this webinar detailing all the significant advancements in Icepak.
Duration
Webinar starts at 16:00 GMT
Who Should Attend?
Designers, engineers, managers and directors seeking to optimise their design & development processes.
Registration / Further Information
Simply choose one of the following options to receive further information or to register.
- Complete the form opposite
- Call us on +44 (0)161 474 6886
- Email us at events@WildeAnalysis.co.uk
Please note that this event is free to attend but registration is essential.
Location
Venue: Online
Address:
Description:
Details on how to join the webinar will be emailed to you once registered.
For further information about ANSYS products, please contact us.