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Webinar: ANSYS 2019 R1 Icepak Product Update
  • 12th February 2019
    4:00 pm - 5:00 pm

Join us to learn about the new capabilities available in ANSYS Icepak. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include: Electro-thermal analysis — Two-way closed loop coupling between ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and Icepak

  • Modelling of inclined PCB
  • DCIR EM loss coupling

Don’t miss this webinar detailing all the significant advancements in Icepak.

Duration

Webinar starts at 16:00 GMT

Who Should Attend?

Designers, engineers, managers and directors seeking to optimise their design & development processes.

Registration / Further Information

Simply choose one of the following options to receive further information or to register.

Please note that this event is free to attend but registration is essential.

Location

Venue:  

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Online

Description:
Details on how to join the webinar will be emailed to you once registered.

For further information about ANSYS products, please contact us.

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