DEFORM 2D Product Suite
DEFORM-2D provides incredible flexibility to designers and analysts working on a range of applications, development and research where the geometry is cylindrical or relatively long in one direction. The cost effective DEFORM-F2 product is ideal for designing hot forging, wire drawing and cold forming processes while the flagship DEFORM-2D system allows users to simulate mechanical joining, fracture and coupled die stress analysis.
Overview
- Deformation and heat transfer are calculated in an integrated simulation environment.
- Two-dimensional simulation can be conducted for axisymmetric or plane strain cases.
- Fully automatic, optimized remeshing is performed during simulation.
- Forming equipment models are available for hydraulic presses, hammers, screw presses and mechanical presses.
- FLOWNET and point tracking deformation, contour plots, loadstroke prediction and more are available in the postprocessor.
DEFORM-2D also includes the following:
- Additional thermal elasto-plastic, thermal rigid viscoplastic and porous material models.
- Multiple deforming body capability for the analysis of multiple plastic workpieces or coupled die stress analysis
- Fracture prediction based on damage models.
- Self-contact boundary condition to allow a simulation to continue even after a lap or fold has formed.
- Multiple operation capability enabling common forming and thermal processes to be set up and run sequentially without intervention.
- Machining distortion ‘template’ to streamline the calculation of distortion after material removal.

Coupled Forming and Multiple Die Stress Analysis Courtesy: SFTC
Wire Drawing

Courtesy: NAMTEC
Multi-Stage Hot Forging Die Stress Analysis

Multi-Stage Hot Forging Die Stress Analysis Courtesy: UEF
Flashless Forging Development

Courtesy: UEF
Bolt Forming

Courtesy: SFTC
Product Installation

Courtesy: Avdel UK Ltd

Monobolt Breakstem (©) Fastener Courtesy: Avdel UK Ltd
DEFORM 2D Inverse Property Extraction
Accurate definition of local heat transfer coefficients as a function of temperature is required to accurately model transient thermal processes. DEFORM provides an optimization-based inverse module that extracts heat transfer coefficients from experimental thermocouple data.
Related Resources
Related News
DEFORM News - Winter 2012 - Simulation of Microforming for Thermal Interface Materials
29th Feb 2012
Positive Response to Wilde’s Simulation Solutions at ‘The Future of Forging Technologies’ Seminar
2nd Dec 2011
DEFORM User Group Meeting - Great Success
21st Nov 2011
DEFORM Newsletter - Autumn 2011 - Focus on Extrusion Modelling Developments
15th Nov 2011
Related Events
SMEA Conference - Optimising the Design and Performance of Engineering Components
19th Jun 2012







