Ansys software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects. This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.
Wireless and RF
Ansys high-frequency electromagnetics design software enables you to design, simulate and validate the performance of antennas and RF and microwave components. The integrated microwave circuit and system modelling capabilities have direct integration to our EM solvers delivering a platform for full-system verification of next-generation RF and microwave designs.
PCB and Electronic Packaging
The Ansys Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis of high-speed electronic devices. Automated thermal analysis and integrated structural analysis capabilities complete the industry’s most comprehensive chip-aware and system-aware simulation solution across the chip-package-board.
Electromechanical and Power Electronics
Ansys electromechanical and power electronics simulation software is ideal for applications which depend on the robust integration of motors, sensors, and actuators with electronics controls. Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analysing critical mechanical effects like noise-vibration-harshness (NVH).
Electronics Thermal Management
Ansys electronics thermal management solutions leverage advanced solver technology with robust, automatic meshing to enable you to rapidly perform heat transfer and fluid flow simulation for convective and forced air cooling strategies. Our solutions help you design cooling strategies to avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centres, power electronics and electric motors.
Applications of Software
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