Webinar Video: Thermal Management of Electronic & Electro-Mechanical Products

Understanding the thermal behaviour and associated structural response of a component is crucial to the design of an electronics product. From initial concept through to manufacturing, ANSYS simulation plays its part in helping engineers eliminate under-performing proposals, while also providing non-invasive methods for performance assessments of potential designs.

This recorded webinar demonstrates ANSYS’ multiphysics capabilities, combining electromagnetic, thermal and structural simulation, relevant to electronics design. Topics covered include:

  • Thermal analysis
    • Joule / resistive heating
    • Transient heat-up and cool-down
  • Structural response
    • Thermal induced stresses and deformations
    • High Acceleration, Shock and Impact Loadings
  • Multiphysics analysis coupling electromagnetics simulation, CFD and FEA – including the leading ANSYS Maxwell, Icepak, and Mechanical solvers
  • Model parameterisation for geometric dimensions and operational conditions
  • Modelling of fans, heat sinks, fins and other components within an electronics assembly
  • Integration with external CAD

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