Understanding the thermal behaviour and associated structural response of a component is crucial to the design of an electronics product. From initial concept through to manufacturing, ANSYS simulation plays its part in helping engineers eliminate under-performing proposals, while also providing non-invasive methods for performance assessments of potential designs.
This recorded webinar demonstrates ANSYS’ multiphysics capabilities, combining electromagnetic, thermal and structural simulation, relevant to electronics design. Topics covered include:
- Thermal analysis
- Joule / resistive heating
- Transient heat-up and cool-down
- Structural response
- Thermal induced stresses and deformations
- High Acceleration, Shock and Impact Loadings
- Multiphysics analysis coupling electromagnetics simulation, CFD and FEA – including the leading ANSYS Maxwell, Icepak, and Mechanical solvers
- Model parameterisation for geometric dimensions and operational conditions
- Modelling of fans, heat sinks, fins and other components within an electronics assembly
- Integration with external CAD