Reliability HotWire is a monthly eMagazine by ReliaSoft providing information and tips on how to best improve your reliability practices and get the most out of ReliaSoft’s tools for reliability and life data analysis.
This Months Hot Topic
Using the General Log-Linear Model in ALTA PRO for Thermal Cycling
Having higher reliability than competitors is one of the key factors for success. This is especially true for the electronics industry. The reliability of electronic products can be predicted based on the design, the manufacturing process and the expected operating conditions. There are many different approaches for reliability estimation such as standards based reliability prediction, physics of failure and life testing. ReliaSoft’s ALTA PRO employs a physics of failure approach and can be used to analyse test data for single or multiple stress conditions. In this article, we will analyse accelerated test data using the Norris-Landzberg model for lead-free solder joint low-cycle fatigue, by using the general log-linear (GLL) model in ALTA PRO.
For full article, view: Reliability Hotwire – Issue 184 June 2016