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Overview Video: Beat The Heat with ANSYS Icepak

Other Resources

ANSYS Icepak provides powerful electronic cooling solutions which utilize the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The ANSYS Icepak CFD solver uses the ANSYS Electronics Desktop (AEDT) graphical user interface (GUI). This provides a CAD-centric solution for engineers who can leverage the easy-to-use ribbon interface to manage thermal issues within the same unified framework as ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor. Electrical and mechanical engineers working in this environment will enjoy a completely automated design flow with seamless coupling from HFSS, Maxwell and Q3D Extractor into Icepak for thermal analysis.

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  • News

    • » New Update: New and Improved Features with PLAXIS 2D 2019 Release
    • » DEFORM News: DEFORM 11.3 Release
    • » New Update: Release of PLAXIS 2D 2018.01
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    • » ANSYS News: ANSYS Empowers Startup Companies Worldwide Through Growing Startup Program
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  • Wilde Analysis Ltd.
    Whitworth House
    28 Charles St
    Stockport
    Cheshire
    SK1 3JR

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