Thermal management problems often exist at the intersection of multiple physics domains. Electrical components, ranging from power-dense miniaturized motors, all the way up to large data centers require convective cooling from fluid flow to maintain optimal temperatures. Fluid-to-solid heat transfer can cause structural deformations and cracks in pipe-lines due to thermal cycling, ultimately resulting in leaks and expensive repairs and down-time.
In this video, we take a look at how coupled physics within Ansys Workbench can be used to simulate such complex problems.
Bringing together the capabilities of both Ansys Fluent (CFD) and Ansys Mechanical (FEA), coupled analysis in Workbench allows us to gain deep insight into how heat transfer through both the solid and fluid domains affects the structural performance of a product. With a Multiphysics set up, we can reduce the need for modelling assumptions. This gives us the confidence to comprehensively explore the design space early on in the product development cycle, reducing the need for expensive prototyping and testing. In this video, we will demonstrate how managing such a complicated task is made easy using system connectivity and data transfers between systems in Workbench.
This is the fifth installment in our series on thermal management. Next week, look out for our upcoming video on Thermal Management in Electronics, focusing on low frequency applications.