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Brochure: Moldex3D IC Packaging

Encapsulation Innovation

Moldex3D provides a variety of solutions for IC packaging, such as transfer molding, compression molding and the UnderFill process simulations for both 2.5D and 3D IC stacking. The UnderFill process includes Capillary UnderFill (CUF), No-flow UnderFill (NUF), Molded UnderFill (MUF), Non-conductive Paste (NCP) and Embedded Wafer Level Package (EMWLP) for the growing application of 3D IC stacking.

This brochure outlines the capabilities and benefits of Moldex3D IC Packaging module.

View: Moldex3D IC Packaging (PDF)

 

 

 

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