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Brochure: ANSYS Icepak

Electronic devices today have smaller footprints and unique power requirements that call for superior thermal designs. Overheated components degrade product reliability, resulting in costly redesigns. To ensure adequate cooling of IC packages, printed circuit boards (PCBs) and complete electronic systems, engineers rely on ANSYS Icepak to validate thermal designs before building any hardware.

View: ANSYS Icepak Brochure (PDF)

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