Webinar: Multiphysics Optimisation of Electronics Systems Using ANSYS Icepak, ANSYS Mechanical and ANSYS optiSLang
- 29th January 2019
4:00 pm - 5:00 pm
Electronics systems are becoming more and more compact, requiring sophisticated optimization techniques to achieve optimal performance. Faced with the growing complexity of the design space, engineers are challenged to identify the key variables that need to be optimised. ANSYS multiphysics simulations help them to meet these challenges.
This webinar will demonstrate a multiphysics simulation procedure for the optimisation of the thermo-mechanical characteristics of an electronics system. The analysis requires a well-parametrised geometry and an automated workflow. ANSYS Icepak and ANSYS Mechanical will perform two-way thermo-mechanical multiphysics simulations, and ANSYS optiSLang will optimise the design for minimal heat sink mass, fan flow rate and thermal stress, while controlling the temperature within specified limits.
Webinar starts at 15:00 GMT
Who Should Attend?
Designers, engineers, managers and directors seeking to optimise their design & development processes.
Registration / Further Information
Simply choose one of the following options to receive further information or to register.
- Complete the form opposite
- Call us on +44 (0)161 474 6886
- Email us at events@WildeAnalysis.co.uk
Please note that this event is free to attend but registration is essential.
Details on how to join the webinar will be emailed to you once registered.
For further information about ANSYS products, please contact us.