Webinar: Tips and Tricks: ANSYS HFSS 3D Components

ANSYS HFSS can utilise ready-made 3D component models for simulation. These components include antennas, radio frequency (RF) connectors and surface-mount devices (e.g., chip capacitors and inductors).  A 3D component model contains all relevant information: geometry, materials, boundary conditions, design parameters and ports (when necessary), for inclusion in a fully coupled, 3D electromagnetic simulation.  In addition, a patented encryption technology allows component providers to hide and protect critical intellectual property (IP), while fully describing their parts for downstream simulation. The benefits of using 3D components range from design reuse to collaboration enablement with vendors, partners or customers.

This webinar will provide tips on creating, editing, managing and sharing HFSS 3D components in your design and simulation flow.

Speaker:
Matt Commens is the lead product manager for HFSS at ANSYS. He was an application engineer specialising in high-frequency electromagnetic simulation at Ansoft Corporation until the merger of the two companies in 2008. Before that, he worked as an antenna designer and simulation manager at RangeStar Wireless in Aptos, California, and as a nuclear magnetic resonance (NMR) probe designer at Varian, Inc. in Palo Alto, California. He holds five patents in the areas of NMR coil and antenna design, and received a B.S. in physics from University of Missouri-Rolla and a Ph.D. in physics from Washington University in St. Louis, Missouri.

Duration

Webinar starts at 16:00 BST

Who Should Attend?

Designers, engineers, managers and directors seeking to optimise their design & development processes.

Registration / Further Information

Simply choose one of the following options to receive further information or to register.

• Complete the form opposite
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Please note that this event is free to attend but registration is essential.

For further information regarding this webinar, please contact us.