Webinar: ANSYS 18 Innovations – Electronics Cooling

ANSYS 18.0 delivers innovative new solutions for electronics cooling. Thermal integrity is a critical design consideration for enclosure design, packages, and PCBs that affect reliability and product lifecycle. Thermal impact on the package, especially from the IC, is a key driver for material selection, cooling and form factor decisions that ultimately determine the size, weight and cost of the final product. It is critical for package and system designers to determine the thermal signature of their system.

Registration / Further Information

This webinar takes place 16th March 2017 at 4:00 PM GMT,  lasting around 1 hour.
Simply choose one of the following options to receive further information or to register.

• Complete the form opposite
• Call us on +44 (0)161 474 6886
• Email us at events@wildeanalysis.co.uk

Please Note:

This event is free to attend, but registration is essential.
Details on how to join the webinar will be emailed to you once registered.

Attend this webinar to learn about important new capabilities in ANSYS 18.0 regarding electronics cooling simulation, such as importing chip thermal models (CTM) from ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete IC, package and PCB. Designers of high-speed digital electronics, and thermal and mechanical engineers involved in electronic design should attend this informative webinar on electronics cooling analysis.