Advanced electronics require more power while occupying less space, leading to a need for liquid cooled systems. In this webinar, we will explore designs using ANSYS Discovery simulations to estimate feasible performance ranges and packaging/space requirements. We will also study design trade-offs from an architectural standpoint (size/shape of flow channel or number fins/veins) to determine requirements of associated systems, like pump sizing or cooler capacity. Learn how you can perform a simulated “bench test” on your best design and compare results to your performance goals, such as surface temperatures or time to reach peak temperature in the assembly.