- 24th February 2022
4:00 pm - 5:00 pm
11 AM EST / 4 PM GMT / 9:30 PM IST
Join us as we explore the new product updates for Ansys Icepak and Ansys Mechanical in Ansys Electronics Desktop.
We enhanced our integrated platform for combined electrical and thermal design and added new capabilities in chip/package co-design, advanced blower modelling, and structural impact on electrical designs.
We’ll also share recent meshing quality and robustness improvements for Icepak and Mechanical.
Registration / Further Information
Simply choose one of the following options to receive further information or to register.
- Complete the form opposite
- Call us on +44 (0)161 474 6886
- Email us at events@WildeAnalysis.co.uk
Please note that this event is free to attend but registration is essential. If you are unable to attend the webinar, please register to receive a copy of the recording when it becomes available.
Location
Venue: Online
Address:
Description:
Details on how to join the webinar will be emailed to you once registered.
What Attendees Will Learn
- How thermal packaging engineers work closely with chip designers to achieve better thermal management designs
- How Ansys delivers tighter integration between electrical, thermal, and structural domains, allowing for design trade-offs earlier in the process
- Easy ways to add complex blower components to Icepak designs