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  • 17th September 2020
    4:00 pm - 5:00 pm

Date: 17 September 2020

Time: 3PM GMT

Venue: Online

This webinar highlights Ansys HFSS’s many dynamic new enhancements provided in Ansys 2020 R2 and delivers a deep dive into powerful new HFSS features for simulating integrated circuits (ICs), microwave/RF components and high-speed electronic devices.

We will preview six major breakthrough advances including:

  • Using direct matrix solving in 3D component domain decomposition method (DDM) for designing complex 5G mmWave antenna arrays.
  • Leveraging Ansys 5G Wizard for simulating bio-compatibility of 5G user equipment to ensure products achieve design specs and meet regulatory standards.
  • Employing Ansys ECAD Xplorer to enable electromagnetic (EM) simulation for ICs with dense functionality and tight design margins at scale and speed.
  • Applying multipaction analysis for electromagnetic breakdown in vacuum environments to support design for tighter margins in space-borne devices, saving on weight and power requirements.
  • Utilizing Ansys EMA3D Cable for providing platform-level electromagnetic interference (EMI)/electromagnetic compatibility (EMC) analysis of cable harnesses.
  • Teaming Ansys RaptorH, a dedicated workflow for IC simulation, with HFSS to provide a gold standard verification for sensitive IC designs.

Registration / Further Information

Simply choose one of the following options to receive further information or to register.

Please note that this event is free to attend but registration is essential.

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Online

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Details on how to join the webinar will be emailed to you once registered.

This webinar highlights Ansys HFSS’s many dynamic new enhancements provided in Ansys 2020 R2

Registration / Further Information

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