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  • 15th September 2020
    8:00 am - 9:00 am

Date: 15 September 2020

Time: 8AM GMT

Venue: Online

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects.

These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.

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Simply choose one of the following options to receive further information or to register.

Please note that this event is free to attend but registration is essential.

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Online

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Details on how to join the webinar will be emailed to you once registered.

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components.

Registration / Further Information

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