Software and Consulting
We provide a complete multiphysics capability to cover all aspects of packaging design, including blow moulding, thermoforming and extrusion polymer processes.
- Ansys Polyflow allows engineers to optimise material distribution — to ensure the absence of weak spots — by simulating the manufacturing process.
- Design geometry (including local material thicknesses) can easily be transferred for structural analysis within Ansys Mechanical to ensure that the product will withstand normal stress and strain.
- Design geometry can also be assessed using Ansys CFD to predict the behavior of the container and liquid, including liquid filling and dispensing simulations.
- ‘What-if’ and optimisation studies can be undertaken using a parametised model.
Industry Challenges Addressed by Simulation
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Material costs have to be minimized
Even saving a tenth of a percent per package can lead to large raw material costs savings.
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Packaging must be structurally sound and resist different structural constraints
Subject to loading such as stacking-up during transport, quizzing of the packages by consumers and dropping accidents.
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The filling process must be optimized
To minimise both filling time and the amount of gas captured.
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Dispensing the liquid must be a positive experience for the customers
The right amount of squeezing for the right amount of product dispensed.
How Can We Help?
For more information or to arrange an informal, no-obligation discussion on your requirements, please complete the form opposite or contact us using the details below.
From an initial phone call we can often give you an idea of price and time scales.
With subsequent details, we can then send you some solution ideas, scopes of work and a formal quotation.