NISA/FEAP
NISA/FEAP has been specifically developed for performing complete and detailed structural, fatigue, thermal and fluid flow analysis on printed circuit boards (PCBs) and the mounted components. FEAP includes stress, random vibration, fatigue life, 3D convective fluid flow and thermal analysis of printed circuit boards (PCBs) and electronic systems.
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Overview
NISA/FEAP integrates into the NISA II/DISPLAY III/IV family of programs to simultaneously perform a wide range of analyses for any PCB configuration. This workflow is assisted by fully automated mesh generation and the pre- and post-processing capabilities.A unique feature of FEAP allows the study of forced cooling effects on PCBs and inside multiple board electronic systems through a complete 3D convective fluid flow analysis.
Key Capabilities
- Steady state heat transfer
- Transient heat transfer
- 3D fluid flow, forced or free convection
- Random vibration
- Frequency response
- Transient dynamics (shock testing)
- Fatigue life computation
Key Features
- Extremely user-friendly graphics pre-processor
- Fully automated finite element mesh generator
- Built-in interfaces to P-CAD, MENTOR GRAPHICS, PCB ENGINEER, etc.
- Large user-expandable built-in library of commercially used component types
- Complete Integration with NISA family of programs
