Fea_electronics_electromagnetics_analysis

Electronics & Electromagnetics Analysis

From the design of solenoids and electric motors to satellite receivers and mobile phones, FEA can predict the behaviour of low and high frequency electromagnetic fields. Furthermore, these devices often also require coupled mechanical and thermal assessment, such as stress on components due to temperature gradients or dynamic/shock loading, or the effect of torques due to electromagnetic forces.

Today electro-mechanical and electronic devices are commonly found in all areas of engineering. The ANSYS portolio contains both single and coupled-physics products which are recognised as leading solutions for these applications. Wilde also supplies the low cost, mature NISA FEAP program specifically aimed at combined structural, fatigue and thermal analysis of printed circuit boards (PCBs)

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Electronics & Electromagnetics Software

ANSYS Multiphysics

ANSYS Multiphysics software offers a comprehensive product solution for both multiphysics and single-physics analysis. The product includes structural, thermal, fluid and both high- and low-frequency electromagnetic analysis. The product also includes solutions for both direct and sequentially c...

ANSYS Electromagnetics

The ANSYS electromagnetic product suite, including the recent addition of Ansoft software, contains both general purpose and application specific products to address a broad array of industry applications. These solutions allow you to accurately simulate electromagnetic fields when predicting the...

NISA FEAP

NISA/FEAP has been specifically developed for performing complete and detailed structural, fatigue, thermal and fluid flow analysis on printed circuit boards (PCBs) and the mounted components. FEAP includes stress, random vibration, fatigue life, 3D convective fluid flow and thermal analysis of p...

NISA EMAG

NISA/EMAG is the electromagnetic module of the NISA suite, solving Maxwell's formulations to determine electric and magnetic field distributions in a wide class of devices. It can be combined with NISA/HEAT to enable a coupled analysis of electromagnetic and thermal fields.