Webinar: Tips and Tricks: ANSYS HFSS 3D Components
- 23rd October 2018
4:00 pm - 5:00 pm
ANSYS HFSS can utilise ready-made 3D component models for simulation. These components include antennas, radio frequency (RF) connectors and surface-mount devices (e.g., chip capacitors and inductors). A 3D component model contains all relevant information: geometry, materials, boundary conditions, design parameters and ports (when necessary), for inclusion in a fully coupled, 3D electromagnetic simulation. In addition, a patented encryption technology allows component providers to hide and protect critical intellectual property (IP), while fully describing their parts for downstream simulation. The benefits of using 3D components range from design reuse to collaboration enablement with vendors, partners or customers.
This webinar will provide tips on creating, editing, managing and sharing HFSS 3D components in your design and simulation flow.
Matt Commens is the lead product manager for HFSS at ANSYS. He was an application engineer specialising in high-frequency electromagnetic simulation at Ansoft Corporation until the merger of the two companies in 2008. Before that, he worked as an antenna designer and simulation manager at RangeStar Wireless in Aptos, California, and as a nuclear magnetic resonance (NMR) probe designer at Varian, Inc. in Palo Alto, California. He holds five patents in the areas of NMR coil and antenna design, and received a B.S. in physics from University of Missouri-Rolla and a Ph.D. in physics from Washington University in St. Louis, Missouri.
Webinar starts at 16:00 BST
Who Should Attend?
Designers, engineers, managers and directors seeking to optimise their design & development processes.
Registration / Further Information
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Please note that this event is free to attend but registration is essential.
Details on how to join the webinar will be emailed to you once registered.
For further information regarding this webinar, please visit the ANSYS website.