Webinar: ANSYS 19 – Icepak Product Update
- 1st March 2018
4:00 pm - 6:00 pm
Attend this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop.
This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. ANSYS Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics.
Register now to learn about Improvements to the SIwave <–> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency.
Webinar starts at 4:00pm
Who Should Attend?
Designers, engineers, managers and directors seeking to optimise their design & development processes.
Registration / Further Information
Simply choose one of the following options to receive further information or to register.
- Register directly here>>
- Complete the form opposite
- Call us on +44 (0)161 474 6886
- Email us at events@WildeAnalysis.co.uk
Please note that this event is free to attend but registration is essential.
Details on how to join the webinar will be emailed to you once registered.
A first look at the ANSYS 19 update, if you would like to discuss the software, please contact us.